Patent Assignment Details
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Reel/Frame: | 018639/0337 | |
| Pages: | 9 |
| | Recorded: | 11/27/2006 | | |
Attorney Dkt #: | bdg039-3 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/02/2008
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Application #:
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11604608
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Filing Dt:
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11/27/2006
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Title:
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METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A LATERALLY ALIGNED BUMPED TERMINAL AND FILLER
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Assignee
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3RD FLOOR, 157 LI-TE ROAD |
PEITOU DISTRICT |
TAIPEI, TAIWAN 112 |
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Correspondence name and address
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DAVID M. SIGMOND
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487 BLACKFOOT STREET
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SUPERIOR, COLORADO 80027
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