Patent Assignment Details
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Reel/Frame: | 045316/0337 | |
| Pages: | 3 |
| | Recorded: | 03/22/2018 | | |
Attorney Dkt #: | 066160-510265 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/14/2019
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Application #:
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15752180
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Filing Dt:
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02/12/2018
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Publication #:
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Pub Dt:
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08/23/2018
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Title:
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Wafer Level Chip Packaging Method
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Assignee
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78 CHANGSHAN AVENUE |
JIANGYIN CITY, CHINA 214437 |
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Correspondence name and address
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ALSTON & BIRD LLP
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BANK OF AMERICA PLAZA
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101 SOUTH TRYON STREET, SUITE 4000
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CHARLOTTE, NC 28280-4000
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