Patent Assignment Details
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| Reel/Frame: | 013023/0338 | |
| Pages: | 4 |
| | Recorded: | 06/14/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/18/2003
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Application #:
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10173213
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Filing Dt:
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06/14/2002
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Publication #:
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Pub Dt:
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08/07/2003
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Title:
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CAVITY-DOWN BALL GRID ARRAY PACKAGE WITH SEMICONDUCTOR CHIP SOLDER BALL
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Assignee
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| NO. 123, SEC. 3, DA FONG RD., TANTZU |
| TAICHUNG, TAIWAN R.O.C |
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Correspondence name and address
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THE LAW OFFICES OF MIKIO ISHIMARU
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MIKIO ISHIMARU
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1110 SUNNYVALE-SARATOGA RD.
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SUITE A1
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SUNNYVALE, CA 94087
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