Patent Assignment Details
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Reel/Frame: | 053193/0338 | |
| Pages: | 7 |
| | Recorded: | 07/13/2020 | | |
Attorney Dkt #: | 27268US04 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/01/2022
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Application #:
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16927454
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Filing Dt:
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07/13/2020
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Publication #:
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Pub Dt:
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06/03/2021
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Title:
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METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV PACKAGES
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Assignee
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2045 E. INNOVATION CIRCLE |
TEMPE, ARIZONA 85284 |
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Correspondence name and address
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AMKOR TECHNOLOGY, INC. C/O MCANDREWS, HE
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500 WEST MADISON ST., FLOOR 34
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CHICAGO, IL 60661
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