Patent Assignment Details
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| Reel/Frame: | 032960/0339 | |
| Pages: | 4 |
| | Recorded: | 05/24/2014 | | |
| Attorney Dkt #: | 930141-2071 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/16/2019
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Application #:
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14235358
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Filing Dt:
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05/24/2014
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Publication #:
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Pub Dt:
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10/23/2014
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Title:
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Method for Assembling a Microelectronic Chip Device in a Fabric, Chip Device, and Fabric Incorporating a Crimped Chip Device
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Assignees
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| 25 RUE LEBLANC, BATIMENT "LE PONANT D" |
| PARIS, FRANCE F-75015 |
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| 2 RUE PIERRE ET MARIE CURIE, |
| BELLIGNAT, FRANCE F-01100 |
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Correspondence name and address
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FROMMER LAWRENCE & HAUG
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745 FIFTH AVENUE- 10TH FL.
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NEW YORK, NY 10151
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06/24/2024 06:03 PM
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