Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 059784/0339 | |
| Pages: | 3 |
| | Recorded: | 05/02/2022 | | |
| Attorney Dkt #: | 4630.0710003 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
05/20/2025
|
Application #:
|
17734683
|
Filing Dt:
|
05/02/2022
|
|
Publication #:
|
|
Pub Dt:
|
08/18/2022
| | | | |
|
Title:
|
Interconnect Structure without Barrier Layer on Bottom Surface of Via
|
|
|
Assignee
|
|
|
|
|
| NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-77 |
|
|
Correspondence name and address
|
| |
STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C.
|
| |
1100 NEW YORK AVENUE NW
|
| |
WASHINGTON, DC 20005
|
Search Results as of:
06/22/2025 01:14 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
