Patent Assignment Details
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| Reel/Frame: | 016620/0342 | |
| Pages: | 3 |
| | Recorded: | 05/27/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/27/2007
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Application #:
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11140054
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Filing Dt:
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05/27/2005
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Publication #:
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Pub Dt:
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12/01/2005
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Title:
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METHOD FOR BALANCING MOLDING FLOW DURING THE ASSEMBLY OF SEMICONDUCTOR PACKAGES WITH DEFECTIVE CARRYING UNITS
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Assignee
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| NO. 26, JINGSAN RD. |
| NANTZ CHIU |
| KAOHSIUNG, TAIWAN R.O.C., 811 |
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Correspondence name and address
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DANIEL R. MCCLURE
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THOMAS, KAYDEN, HORSTEMEYER & RISLEY LLP
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100 GALLERIA PARKWAY
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SUITE 1750
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ATLANTA, GEORGIA 30339
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