Patent Assignment Details
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Reel/Frame: | 027469/0342 | |
| Pages: | 3 |
| | Recorded: | 01/03/2012 | | |
Attorney Dkt #: | INF 2010 P 50686 US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/24/2012
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Application #:
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12851292
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Filing Dt:
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08/05/2010
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Publication #:
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Pub Dt:
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02/09/2012
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Title:
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METALLIZATION FOR CHIP SCALE PACKAGES IN WAFER LEVEL PACKAGING
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Assignee
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AM CAMPEON 1-12 |
NEUBIBERG, GERMANY 85579 |
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Correspondence name and address
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SLATER & MATSIL, L.L.P.
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17950 PRESTON RD.
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SUITE 1000
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DALLAS, TX 75252
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