Patent Assignment Details
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| Reel/Frame: | 052600/0344 | |
| Pages: | 2 |
| | Recorded: | 05/07/2020 | | |
| Attorney Dkt #: | KPH-0107 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/27/2022
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Application #:
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16762291
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Filing Dt:
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05/07/2020
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Publication #:
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Pub Dt:
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11/12/2020
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Title:
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POLISHING PAD FOR WAFER POLISHING APPARATUS AND MANUFACTURING METHOD THEREFOR
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Assignee
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| 53 IMSU-RO |
| GUMI-SI, GYEONGSANGBUK-DO, KOREA, REPUBLIC OF 39386 |
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Correspondence name and address
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KED & ASSOCIATES, LLP
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P.O. BOX 8638
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RESTON, VA 20195
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06/21/2024 05:18 AM
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