Patent Assignment Details
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| Reel/Frame: | 014632/0346 | |
| Pages: | 3 |
| | Recorded: | 05/14/2004 | | |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT ASSIGNOR'S NAME. DOCUMENT PREVIOUSLY RECORDED AT REEL 014449 FRAME 0314. |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/01/2005
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Application #:
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10649847
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Filing Dt:
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08/26/2003
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Title:
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LIGHT SENSITIVE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
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Assignee
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| NO. 2, LI-HSIN ROAD |
| 3, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN R.O.C. |
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Correspondence name and address
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ANDERSON KILL & OLICK, P.C.
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EUGENE LIEBERSTEIN
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1251 AVENUE OF THE AMERICAS
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NEW YORK, NY 10020
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