Patent Assignment Details
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Reel/Frame: | 055412/0347 | |
| Pages: | 4 |
| | Recorded: | 02/25/2021 | | |
Attorney Dkt #: | 1012-2898 / 2019P55562 US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/27/2023
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Application #:
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17149891
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Filing Dt:
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01/15/2021
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Publication #:
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Pub Dt:
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07/22/2021
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Title:
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Additive Manufacturing of a Frontside or Backside Interconnect of a Semiconductor Die
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Assignee
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SIEMENSSTRASSE 2 |
VILLACH, AUSTRIA 9500 |
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Correspondence name and address
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MURPHY, BILAK & HOMILLER/INFINEON TECHNO
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1255 CRESCENT GREEN
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SUITE 200
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CARY, NC 27518
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06/14/2024 11:16 AM
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