Patent Assignment Details
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| Reel/Frame: | 061715/0348 | |
| Pages: | 8 |
| | Recorded: | 11/10/2022 | | |
| Attorney Dkt #: | 520064.5000004 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17984032
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Filing Dt:
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11/09/2022
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Publication #:
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Pub Dt:
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05/11/2023
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Title:
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METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD INCLUDING EXTREME FINE VIA AND MULTI-LAYER CIRCUIT BOARD MANUFACTURED BY THE SAME
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Assignee
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| 189, GUNSU 1-GIL, JIKSAN-EUP |
| SEOBUK-GU, CHEONAN-SI |
| CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 31032 |
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Correspondence name and address
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CROWELL & MORING LLP
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P.O. BOX 10395
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CHICAGO, IL 60610
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