Patent Assignment Details
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Reel/Frame: | 024771/0349 | |
| Pages: | 2 |
| | Recorded: | 08/01/2010 | | |
Attorney Dkt #: | BDG061 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/31/2012
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Application #:
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12848175
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Filing Dt:
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08/01/2010
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Title:
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SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND CERAMIC BLOCK IN POST
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Assignee
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3RD FLOOR, 157 LI-TE ROAD, PEITOU DISTRICT |
TAIPEI, TAIWAN 112 |
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Correspondence name and address
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DAVID M. SIGMOND
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10 ANSON ROAD #47-14
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SINGAPORE, 079903 SINGAPORE
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