Patent Assignment Details
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| Reel/Frame: | 043262/0349 | |
| Pages: | 5 |
| | Recorded: | 08/10/2017 | | |
| Attorney Dkt #: | 103P001267US.DIV |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/13/2019
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Application #:
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15674062
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Filing Dt:
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08/10/2017
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Publication #:
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Pub Dt:
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11/23/2017
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Title:
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FAN-OUT WAFER LEVEL CHIP PACKAGE STRUCTURE
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Assignees
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| 12F., NO.368, GONGJIAN RD., XIZHI DIST. |
| NEW TAIPEI CITY, TAIWAN 221 |
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| 6F., NO.366, GONGJIAN RD., 6F., NO.366, GONGJIAN RD. |
| NEW TAIPEI CITY, TAIWAN 221 |
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Correspondence name and address
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LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE
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3057 NUTLEY STREET
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SUITE 818
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FAIRFAX, VA 22031
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