Patent Assignment Details
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| Reel/Frame: | 020731/0350 | |
| Pages: | 4 |
| | Recorded: | 03/31/2008 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12005538
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Filing Dt:
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12/27/2007
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Publication #:
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Pub Dt:
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04/30/2009
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Title:
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Method and apparatus to prewet wafer surface for metallization from electrolyte solutions
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Assignee
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| ROOM 210, 900 SONGZHENG ROAD |
| SONGJIANG |
| SHANGHAI 201614, CHINA |
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Correspondence name and address
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ROBERT B. COHEN
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LERNER, DAVID, LITTENBERG,
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KRUMHOLZ & MENTLIK, LLP
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600 SOUTH AVENUE WEST
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WESTFIELD, NJ 07090
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