Patent Assignment Details
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Reel/Frame: | 009913/0351 | |
| Pages: | 3 |
| | Recorded: | 04/21/1999 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/10/2001
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Application #:
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09295342
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Filing Dt:
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04/21/1999
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Title:
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MULTICHIP MODULES AND MANUFACTURING METHOD THEREFOR
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Assignee
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NO. 26, CHIN 3RD ROAD NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN R.O.C |
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Correspondence name and address
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WATSON COLE GRINDLE WATSON
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JOHN P. DELUCA
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1400 K STREET, N.W.
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10TH FLOOR
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WASHINGTON, DC 20005-2477
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