Patent Assignment Details
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Reel/Frame: | 016934/0352 | |
| Pages: | 4 |
| | Recorded: | 08/26/2005 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/19/2008
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Application #:
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11213398
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Filing Dt:
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08/26/2005
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Publication #:
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Pub Dt:
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01/19/2006
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Title:
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SEMICONDUCTOR CHIP ASSEMBLY WITH METAL CONTAINMENT WALL AND SOLDER TERMINAL
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Assignee
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3RD FLOOR, 157 LI-TE ROAD |
PEITOU DISTRICT |
TAIPEI, TAIWAN 112 |
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Correspondence name and address
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DAVID M. SIGMOND
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487 BLACKFOOT STREET
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SUPERIOR, COLORADO 80027
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