Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 038755/0352 | |
| Pages: | 6 |
| | Recorded: | 05/31/2016 | | |
| Attorney Dkt #: | TW0027-DSS-TSMC |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
8
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Patent #:
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Issue Dt:
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03/08/2005
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Application #:
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10627059
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Filing Dt:
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07/25/2003
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Title:
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METHOD OF MAKING A MOS TRANSISTOR
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Patent #:
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Issue Dt:
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06/21/2005
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Application #:
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10747109
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Filing Dt:
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12/30/2003
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Publication #:
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Pub Dt:
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08/05/2004
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Title:
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THIN FILM CAPACITOR AND FABRICATION METHOD THEREOF
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Patent #:
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Issue Dt:
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06/07/2005
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Application #:
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10748428
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Filing Dt:
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12/30/2003
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Publication #:
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Pub Dt:
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10/21/2004
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Title:
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SIDE BRAZE PACKAGES
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Patent #:
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Issue Dt:
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09/27/2005
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Application #:
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10751183
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Filing Dt:
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12/30/2003
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Publication #:
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Pub Dt:
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11/18/2004
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Title:
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SEMICONDUCTOR PACKAGE AND STRUCTURE THEREOF
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Patent #:
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Issue Dt:
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01/04/2005
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Application #:
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10751209
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Filing Dt:
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12/30/2003
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Publication #:
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Pub Dt:
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08/12/2004
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Title:
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CERAMIC PACKAGING METHOD EMPLOYING FLIP-CHIP BONDING
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Patent #:
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Issue Dt:
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04/05/2005
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Application #:
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10794200
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Filing Dt:
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03/05/2004
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Publication #:
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Pub Dt:
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09/02/2004
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Title:
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SEMICONDUCTOR DEVICE AND A FABRICATION METHOD THEREOF
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Patent #:
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Issue Dt:
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11/20/2007
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Application #:
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11024653
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Filing Dt:
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12/30/2004
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Publication #:
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Pub Dt:
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01/05/2006
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Title:
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CAPACITOR OF SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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05/12/2009
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Application #:
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11781547
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Filing Dt:
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07/23/2007
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Publication #:
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Pub Dt:
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02/07/2008
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Title:
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SIP SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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Assignee
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 30077 |
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Correspondence name and address
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JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
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7F.-1, NO. 100, ROOSEVELT RD., SEC. 2,
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TAIPEI, 100 TAIWAN
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