Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 067135/0353 | |
| Pages: | 6 |
| | Recorded: | 04/17/2024 | | |
| Attorney Dkt #: | 3047.0600005[17-108904US] |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
4
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Patent #:
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Issue Dt:
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10/15/2019
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Application #:
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16029144
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Filing Dt:
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07/06/2018
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Title:
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Integrated Assemblies Having Thicker Semiconductor Material Along One Region of a Conductive Structure than Along Another Region
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Patent #:
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Issue Dt:
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08/25/2020
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Application #:
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16439278
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Filing Dt:
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06/12/2019
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Publication #:
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Pub Dt:
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01/09/2020
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Title:
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Integrated Assemblies Having Thicker Semiconductor Material Along One Region of a Conductive Structure than Along Another Region, and Methods of Forming Integrated Assemblies
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Patent #:
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Issue Dt:
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08/10/2021
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Application #:
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16937516
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Filing Dt:
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07/23/2020
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Publication #:
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Pub Dt:
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11/12/2020
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Title:
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Integrated Assemblies Having Thicker Semiconductor Material Along One Region of a Conductive Structure than Along Another Region, and Methods of Forming Integrated Assemblies
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Patent #:
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Issue Dt:
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07/04/2023
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Application #:
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17383988
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Filing Dt:
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07/23/2021
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Publication #:
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Pub Dt:
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11/11/2021
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Title:
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Integrated Assemblies Having Thicker Semiconductor Material Along One Region of a Conductive Structure than Along Another Region, and Methods of Forming Integrated Assemblies
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Assignee
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| 1603 ORRINGTON AVE |
| SUITE 600 |
| EVANSTON, ILLINOIS 60201 |
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Correspondence name and address
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BROOKS CAMERON & HUEBSCH PLLC
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1201 MARQUETTE AVENUE SOUTH, SUITE 400
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MINNEAPOLIS, MN 55403
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05/25/2024 02:18 PM
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