Patent Assignment Details
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Reel/Frame: | 062118/0355 | |
| Pages: | 10 |
| | Recorded: | 12/15/2022 | | |
Attorney Dkt #: | 100459-US-PA-1 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18077191
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Filing Dt:
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12/07/2022
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Publication #:
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Pub Dt:
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03/30/2023
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Title:
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STRUCTURE OF SEMICONDUCTOR DEVICE
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Assignee
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NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK, |
HSINCHU, TAIWAN |
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Correspondence name and address
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JCIPRNET
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8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
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TAIPEI, 100404 TAIWAN
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