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Patent Assignment Details
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Reel/Frame:023073/0357   Pages: 5
Recorded: 08/10/2009
Attorney Dkt #:DP10029
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
04/24/2012
Application #:
12473179
Filing Dt:
05/27/2009
Publication #:
Pub Dt:
12/02/2010
Title:
THIN SEMICONDUCTOR DEVICE HAVING EMBEDDED DIE SUPPORT AND METHODS OF MAKING THE SAME
Assignors
1
Exec Dt:
08/07/2009
2
Exec Dt:
08/10/2009
3
Exec Dt:
08/07/2009
Assignee
1
21440 WEST LAKE COOK ROAD, 7TH FLOOR
PATENTS & LICENSES
DEER PARK, ILLINOIS 60010
Correspondence name and address
TEMIC AUTOMOTIVE OF NORTH AMERICA, INC.
21440 WEST LAKE COOK ROAD, 7TH FLOOR
PATENTS & LICENSES
DEER PARK, IL 60010

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