Patent Assignment Details
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Reel/Frame: | 052759/0357 | |
| Pages: | 3 |
| | Recorded: | 05/27/2020 | | |
Attorney Dkt #: | 01482.0870US01 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/26/2022
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Application #:
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16884294
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Filing Dt:
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05/27/2020
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Publication #:
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Pub Dt:
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12/02/2021
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Title:
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METHOD FOR TOUCH SENSING ENHANCEMENT IMPLEMENTED IN SINGLE CHIP, SINGLE CHIP CAPABLE OF ACHIEVING TOUCH SENSING ENHANCEMENT, AND COMPUTING APPARATUS
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Assignee
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2F, NO. 13, INNOVATION RD., 1, HSINCHU SCIENCE PARK |
HSINCHU 300, TAIWAN |
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Correspondence name and address
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SCHMEISER, OLSEN & WATTS
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22 CENTURY HILL DRIVE
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SUITE 302
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LATHAM, NY 12110
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09/25/2024 01:13 PM
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