Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 014200/0358 | |
| Pages: | 5 |
| | Recorded: | 12/16/2003 | | |
Conveyance: | CORRECTIVE ASSIGNMENT TO ADD ASSIGNEE NAME, PREVIOUSLY RECORDED ON REEL 013651 FRAME 0959. |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10243972
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Filing Dt:
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09/12/2002
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Publication #:
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Pub Dt:
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06/12/2003
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Title:
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Process for bonding and electrically connecting microsystems integrated in several distinct substrates
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Assignees
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VIA C. OLIVETTI, 2 |
I-20041 AGRATE BRIANZA, ITALY |
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11413 CHINDEN BOULEVARD |
BOISE, IDAHO 83714 |
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Correspondence name and address
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SEED INTELLECTUAL PROPERTY ET AL.
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HAROLD H. BENNETT II
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701 FIFTH AVENUE, SUITE 6300
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SEATTLE, WA 98104-7092
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09/22/2024 06:56 AM
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