Patent Assignment Details
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| Reel/Frame: | 020910/0358 | |
| Pages: | 3 |
| | Recorded: | 04/24/2008 | | |
| Attorney Dkt #: | 1937-1225 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/01/2010
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Application #:
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12149014
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Filing Dt:
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04/24/2008
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Publication #:
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Pub Dt:
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05/14/2009
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Title:
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METHOD OF MANUFACTURING A WAFER LEVEL PACKAGE THAT USES THE SAME SEED LAYER FOR SELECTIVELY ELECTROPLATING A REWIRING PATTERN AND A CONDUCTIVE PILLAR
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Assignee
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| 314, MAETAN3-DONG, YEONGTONG-GU, SUWON |
| GYUNGGI-DO, KOREA, REPUBLIC OF 443-743 |
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Correspondence name and address
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STAAS & HALSEY LLP
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ATTENTION; DAVID M. PITCHER
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1201 NEW YORK AVE., N.W.
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SUITE 700
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WASHINGTON, DC 20005
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