Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 031192/0358 | |
| Pages: | 3 |
| | Recorded: | 09/12/2013 | | |
| Attorney Dkt #: | 1728.009 CIP1 CON |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/30/2014
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Application #:
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14024928
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Filing Dt:
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09/12/2013
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Publication #:
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Pub Dt:
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01/09/2014
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Title:
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DIE UP FULLY MOLDED FAN-OUT WAFER LEVEL PACKAGING
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Assignee
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| 7855 SOUTH RIVER PARKWAY, SUITE 111 |
| TEMPE, ARIZONA 85284 |
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Correspondence name and address
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BOOTH UDALL FULLER, PLC
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1255 W. RIO SALADO PKWY.
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SUITE 215
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TEMPE, AZ 85281
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