Patent Assignment Details
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Reel/Frame: | 054831/0358 | |
| Pages: | 4 |
| | Recorded: | 01/06/2021 | | |
Attorney Dkt #: | TSMP20203468US01 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/21/2023
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Application #:
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17140897
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Filing Dt:
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01/04/2021
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Publication #:
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Pub Dt:
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03/17/2022
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Title:
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VOID ELIMINATION FOR GAP-FILLING IN HIGH-ASPECT RATIO TRENCHES
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Assignee
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8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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SLATER MATSIL, LLP
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17950 PRESTON RD., SUITE 1000
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DALLAS, TX 75252
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06/21/2024 08:49 AM
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