Patent Assignment Details
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Reel/Frame: | 012885/0360 | |
| Pages: | 3 |
| | Recorded: | 05/10/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/24/2004
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Application #:
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10081425
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Filing Dt:
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02/22/2002
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Publication #:
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Pub Dt:
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09/05/2002
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Title:
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APPARATUS AND PROCESS FOR PRECISE ENCAPSULATION OF FLIP CHIP INTERCONNNECTS
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Assignee
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47400 KATO ROAD |
FREMONT, CALIFORNIA 94538 |
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Correspondence name and address
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HAYNES BEFFEL & WOLFELD LLP
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BILL KENNEDY
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P.O. BOX 366
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HALF MOON BAY, CA 94019
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