Patent Assignment Details
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| Reel/Frame: | 007191/0361 | |
| Pages: | 4 |
| | Recorded: | 09/14/1994 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/15/1999
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Application #:
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08312744
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Filing Dt:
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09/14/1994
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Title:
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METHOD FOR FABRICATING STACKED LAYER SILICON NITRIDE FOR LOW LEAKAGE AND HIGH CAPACITANCE
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Assignee
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| MAIL STOP 507 PATENT DEPARTMENT |
| 2805 E. COLUMBIA ROAD |
| BOISE, IDAHO 83706 |
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Correspondence name and address
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LIA M. PAPPAS
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MAIL STOP 507
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PATENT DEPARTMENT
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2805 E. COLUMBIA ROAD
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BOISE, ID 83706
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