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Reel/Frame:021899/0361   Pages: 4
Recorded: 11/10/2008
Attorney Dkt #:LICH3021/EM
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
12289991
Filing Dt:
11/10/2008
Publication #:
Pub Dt:
02/11/2010
Title:
Method for fabricating package structure of stacked chips
Assignors
1
Exec Dt:
09/24/2008
2
Exec Dt:
09/24/2008
3
Exec Dt:
09/24/2008
4
Exec Dt:
09/24/2008
5
Exec Dt:
09/25/2008
6
Exec Dt:
09/25/2008
Assignee
1
NO. 118, CHUNG-HUA RD., CHU-NAN
MIAO-LI 35053, TAIWAN R.O.C.
Correspondence name and address
BACON & THOMAS, PLLC
625 SLATERS LANE
FOURTH FLOOR
ALEXANDRIA, VA 22314

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