Patent Assignment Details
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| Reel/Frame: | 046882/0361 | |
| Pages: | 3 |
| | Recorded: | 09/14/2018 | | |
| Attorney Dkt #: | 131642-241837 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/05/2020
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Application #:
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16085496
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Filing Dt:
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09/14/2018
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Publication #:
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Pub Dt:
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04/25/2019
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Title:
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SEMICONDUCTOR PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREFOR
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Assignee
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| 726, UNGNAM-RO, SEONGSAN-GU |
| GYEONGSANGNAM-DO |
| CHANGWON-SI, KOREA, REPUBLIC OF 51552 |
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Correspondence name and address
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SCHWABE WILLIAMSON & WYATT, PC
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1211 SW FIFTH AVE.
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SUITE 1900
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PORTLAND, OR 97204
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