Patent Assignment Details
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Reel/Frame: | 020141/0362 | |
| Pages: | 4 |
| | Recorded: | 11/19/2007 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11942487
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Filing Dt:
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11/19/2007
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Publication #:
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Pub Dt:
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07/31/2008
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Title:
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PACKAGE STRUCTURE WITH EMBEDDED CAPACITOR, FABRICATING PROCESS THEREOF AND APPLICATIONS OF THE SAME
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Assignee
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26, CHIN 3RD. RD., 811, NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN ROC |
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Correspondence name and address
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J.C. PATENTS
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4 VENTURE, SUITE 250
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IRVINE, CA 92618
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