Patent Assignment Details
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| Reel/Frame: | 024516/0362 | |
| Pages: | 3 |
| | Recorded: | 06/07/2010 | | |
| Attorney Dkt #: | 2084.1001 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/26/2011
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Application #:
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12083864
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Filing Dt:
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04/18/2008
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Publication #:
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Pub Dt:
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10/15/2009
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Title:
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THERMOSETTING RESIN COMPOSITION AND SEMICONDUCTOR SEALING MEDIUM
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Assignee
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| 1-105, KANDA JINBO-CHO, |
| CHIYODA-KU, TOKYO 101-8101, JAPAN |
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Correspondence name and address
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STAAS & HALSEY LLP
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ATTENTION: MARK J. HENRY
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1201 NEW YORK AVE., N.W., 7TH FLOOR
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WASHINGTON, D.C. 20005
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