Patent Assignment Details
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| Reel/Frame: | 037398/0363 | |
| Pages: | 2 |
| | Recorded: | 12/30/2015 | | |
| Attorney Dkt #: | P15P0056/US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14902085
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Filing Dt:
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12/30/2015
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Publication #:
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Pub Dt:
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12/22/2016
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Title:
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METHOD FOR FORMING PAD OF WAFER
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Assignee
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| (SK-U TOWER, JEONGJA-DONG) 16F, 343 BEON-GIL 9, SEONGNAM-DAERO BUNDANG-GU |
| SEONGNAM-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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IP & T GROUP LLP
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8230 LEESBURG PIKE SUITE 650
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VIENNA, VA 22182
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