Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 046461/0363 | |
| Pages: | 3 |
| | Recorded: | 07/25/2018 | | |
| Attorney Dkt #: | 890102.405 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/09/2021
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Application #:
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16017665
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Filing Dt:
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06/25/2018
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Publication #:
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Pub Dt:
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12/26/2019
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Title:
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THICKNESS SENSOR FOR CONDUCTIVE FEATURES
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Assignee
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 30078 |
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Correspondence name and address
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SEED IP LAW GROUP LLP
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701 FIFTH AVENUE
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SUITE 5400
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SEATTLE, WA 98104
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05/28/2024 08:23 PM
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