Patent Assignment Details
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Reel/Frame: | 050646/0364 | |
| Pages: | 3 |
| | Recorded: | 10/07/2019 | | |
Attorney Dkt #: | TWT06844/US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/02/2021
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Application #:
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16594059
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Filing Dt:
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10/06/2019
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Title:
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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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Assignee
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NO.98, NANLIN RD., TAISHAN DIST. |
NEW TAIPEI CITY, TAIWAN 243 |
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Correspondence name and address
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CKC & PARTNERS CO., LLC
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12345 LAKE CITY WAY NE, NO. 283
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SEATTLE, WA 98125
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09/22/2024 10:33 PM
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