Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 067535/0364 | |
| Pages: | 11 |
| | Recorded: | 05/29/2024 | | |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY DATA FROM STATS CHIPPAC PTE. LTE. TO STATS CHIPPAC LTD. AND CORRECT THE NAME OF RECEIVING PARTY DATA FROM STATS CHIPPAC PTE. LTE. TO STATS CHIPPAC PTE. LTD. PREVIOUSLY RECORDED AT REEL: 64838 FRAME: 948. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. |
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Total properties:
6
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Patent #:
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Issue Dt:
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02/09/2010
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Application #:
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11849127
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Filing Dt:
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08/31/2007
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Publication #:
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Pub Dt:
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03/05/2009
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Title:
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INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH CARRIER INTERPOSER
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Patent #:
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Issue Dt:
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01/12/2010
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Application #:
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11941409
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Filing Dt:
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11/16/2007
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Publication #:
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Pub Dt:
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05/21/2009
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE SUBSTRATE HAVING CORNER CONTACTS
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Patent #:
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Issue Dt:
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06/08/2010
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Application #:
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12050428
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Filing Dt:
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03/18/2008
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Publication #:
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Pub Dt:
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09/24/2009
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ISOLATED LEADS
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Patent #:
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Issue Dt:
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06/22/2010
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Application #:
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12055962
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Filing Dt:
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03/26/2008
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Publication #:
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Pub Dt:
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10/01/2009
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKING MODULE
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Patent #:
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Issue Dt:
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07/06/2010
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Application #:
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12056418
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Filing Dt:
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03/27/2008
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Publication #:
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Pub Dt:
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10/01/2009
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Title:
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STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM
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Patent #:
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Issue Dt:
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04/27/2010
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Application #:
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12133177
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Filing Dt:
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06/04/2008
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Publication #:
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Pub Dt:
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12/10/2009
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING RECESSED CONDUCTIVE VIAS IN SAW STREETS
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Assignee
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE |
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Correspondence name and address
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YANGZHOU DU
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8407 CENTRAL AVE, SUITE 2077
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NEWARK, CA 94560-3431
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