Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 038581/0367 | |
| Pages: | 7 |
| | Recorded: | 04/29/2016 | | |
| Attorney Dkt #: | 092990; 092990D1 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE FULL ASSIGNEE NAME TO: MEGIC CORPORATION PREVIOUSLY RECORDED ON REEL 011236 FRAME 0426. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT FROM MOU-SHIUNG LIN; JIN-YUAN LEE TO MEGIC CORPORATION. |
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Total properties:
2
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Patent #:
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Issue Dt:
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12/17/2002
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Application #:
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09691497
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Filing Dt:
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10/18/2000
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Title:
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POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF THE IC CHIPS
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Patent #:
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Issue Dt:
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05/11/2004
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Application #:
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10278106
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Filing Dt:
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10/22/2002
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Publication #:
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Pub Dt:
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03/27/2003
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Title:
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POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF THE IC CHIPS
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Assignee
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| 21 R & D FIRST ROAD |
| SCIENCE BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN |
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Correspondence name and address
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MEGIC CORPORATION
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21 R & D FIRST ROAD
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SCIENCE BASED INDUSTRIAL PARK
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HSIN-CHU, TAIWAN
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