Patent Assignment Details
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| Reel/Frame: | 010854/0368 | |
| Pages: | 4 |
| | Recorded: | 06/19/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/28/2001
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Application #:
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09561057
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Filing Dt:
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04/28/2000
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Title:
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Intergration of heat conducting apparatus and chip carrier in IC package
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Assignee
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| NO. 123, SEC. 3, DA FONG RD. |
| TANTZU TAICHUNG, TAIWAN R.O.C |
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Correspondence name and address
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KLARQUIST SPARKMAN CAMPBELL ET AL
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MARK L. BECKER
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ONE WORLD TRADE CENTER, SUITE 1600
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121 S.W. SALMON STREET
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PORTLAND, OR 97204-2988
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