Patent Assignment Details
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Reel/Frame: | 013121/0368 | |
| Pages: | 2 |
| | Recorded: | 07/16/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/24/2004
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Application #:
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10195716
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Filing Dt:
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07/16/2002
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Publication #:
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Pub Dt:
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03/06/2003
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Title:
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METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING A CONDUCTIVE LAYER TO PREVENT PEELING BETWEEN A BONDING PAD AND AN UNDERLYING INSULATING FILM
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Assignee
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6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU |
TOKYO, JAPAN |
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Correspondence name and address
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MILES & STOCKBRIDGE, P.C.
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MITCHELL W. SHAPIRO
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1751 PINNACLE DRIVE
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SUITE 500
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MCLEAN, VA 22102
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