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Reel/Frame:070468/0369   Pages: 4
Recorded: 03/11/2025
Attorney Dkt #:2017-2971/24061.3733US05
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18974295
Filing Dt:
12/09/2024
Publication #:
Pub Dt:
03/27/2025
Title:
SEMICONDUCTOR STRUCTURE WITH AIR GAP AND METHOD SEALING THE AIR GAP
Assignors
1
Exec Dt:
01/02/2019
2
Exec Dt:
01/02/2019
3
Exec Dt:
01/02/2019
Assignee
1
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondence name and address
MU WEI HSU
HAYNES AND BOONE - 2801 N. HARWOOD STREET
SUITE 2300
DALLAS, TX 75201

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