Patent Assignment Details
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Reel/Frame: | 021880/0370 | |
| Pages: | 3 |
| | Recorded: | 11/24/2008 | | |
Attorney Dkt #: | P27246 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12284542
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Filing Dt:
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09/22/2008
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Publication #:
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Pub Dt:
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03/25/2010
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Title:
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Coreless substrate, method of manufacturing same, and package for microelectronic device incorporating same
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Assignee
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2200 MISSION COLLEGE BLVD. |
SANTA CLARA, CALIFORNIA 95052 |
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Correspondence name and address
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INTEL CORPORATION, C/O INTELLEVATE, LLC
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PO BOX 52050
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MINNEAPOLIS, MN 55402
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06/01/2024 02:17 PM
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