Patent Assignment Details
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Reel/Frame: | 029927/0370 | |
| Pages: | 4 |
| | Recorded: | 02/12/2013 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/10/2015
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Application #:
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13809816
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Filing Dt:
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02/12/2013
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Publication #:
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Pub Dt:
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06/06/2013
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Title:
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DICING/DIE BONDING INTEGRAL FILM, DICING/DIE BONDING INTEGRAL FILM MANUFACTURING METHOD, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD
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Assignee
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9-2, MARUNOUCHI 1-CHOME |
CHIYODA-KU, TOKYO, JAPAN |
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Correspondence name and address
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JUAN CARLOS A. MARQUEZ
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C/O STITES & HARBISON PLLC
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1199 NORTH FAIRFAX STREET
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SUITE 900
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ALEXANDRIA VA 22314-1437
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