Patent Assignment Details
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| Reel/Frame: | 055803/0370 | |
| Pages: | 3 |
| | Recorded: | 04/01/2021 | | |
| Attorney Dkt #: | P20174008US00/N1085-01887 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/20/2021
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Application #:
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16562801
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Filing Dt:
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09/06/2019
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Publication #:
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Pub Dt:
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03/26/2020
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Title:
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STRUCTURES AND METHODS FOR REDUCING THERMAL EXPANSION MISMATCH DURING INTEGRATED CIRCUIT PACKAGING
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Assignee
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| NO. 8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK |
| HSIN-CHU, TAIWAN 300-77 |
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Correspondence name and address
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DUANE MORRIS LLP - SAN DIEGO
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750 B STREET
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SUITE 2900
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SAN DIEGO, CA 92101-4681
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