Patent Assignment Details
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Reel/Frame: | 015523/0371 | |
| Pages: | 2 |
| | Recorded: | 06/28/2004 | | |
Attorney Dkt #: | 082440042 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/12/2007
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Application #:
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10876590
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Filing Dt:
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06/28/2004
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Publication #:
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Pub Dt:
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06/30/2005
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Title:
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METHOD FOR FORMING LANDING PLUG CONTACTS IN SEMICONDUCTOE DEVICE
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Assignee
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SAN 136-1, AMI-RI, BUBAL-EUB, ICHON-SHI |
KYOUNGKI-DO 467-860, KOREA, REPUBLIC OF |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW ET AL.
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ERNEST F. CHAPMAN
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1300 I STREET, N.W.
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WASHINGTON, DC 20005-3315
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