Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 037588/0372 | |
| Pages: | 3 |
| | Recorded: | 01/26/2016 | | |
| Attorney Dkt #: | 1728.009 CIP1 CON2 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/10/2016
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Application #:
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14584978
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Filing Dt:
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12/29/2014
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Publication #:
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Pub Dt:
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04/30/2015
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Title:
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DIE UP FULLY MOLDED FAN-OUT WAFER LEVEL PACKAGING
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Assignee
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| 7855 SOUTH RIVER PARKWAY, STE. 111 |
| TEMPE, ARIZONA 85284 |
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Correspondence name and address
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CHANTAL MARTIN
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1255 W. RIO SALADO PKWY., STE. 215
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TEMPE, AZ 85281
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