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Patent Assignment Details
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Reel/Frame:018061/0373   Pages: 4
Recorded: 08/07/2006
Attorney Dkt #:B0660-0045
Conveyance: SECURITY AGREEMENT
Total properties: 6
1
Patent #:
Issue Dt:
12/29/1998
Application #:
08704467
Filing Dt:
08/28/1996
Title:
TRANSIENT LIQUID PHASE SINTERING CONDUCTIVE ADHESIVES
2
Patent #:
Issue Dt:
09/07/1999
Application #:
08813809
Filing Dt:
03/06/1997
Title:
VERTICALLY INTERCONNECTED ELECTRONIC ASSEMBLIES AND COMPOSITIONS USEFUL THEREFOR
3
Patent #:
Issue Dt:
07/13/1999
Application #:
08816401
Filing Dt:
03/03/1997
Title:
METAL-PLATING OF CURED AND SINTERED TRANSIENT LIQUID PHASE SINTERING PASTES
4
Patent #:
Issue Dt:
11/09/1999
Application #:
08942368
Filing Dt:
10/02/1997
Title:
NOVEL METAL-CONTAINING COMPOSITIONS AND USES THEREOF, INCLUDING PREPARATION OF RESISTOR AND THERMISTOR ELEMENTS
5
Patent #:
Issue Dt:
10/03/2000
Application #:
09093966
Filing Dt:
06/08/1998
Title:
PROCESS FOR PRODUCING HIGH PERFORMANCE THERMOELECTRIC MODULES
6
Patent #:
Issue Dt:
07/11/2000
Application #:
09123563
Filing Dt:
07/27/1998
Title:
METHODS TO PRODUCE INSULATED CONDUCTIVE THROUGH-FEATURES IN CONDUCTIVE CORE MATERIALS FOR ELECTRONIC PACKAGING
Assignor
1
Exec Dt:
07/31/2006
Assignee
1
55 SOUTH LAKE AVENUE, SUITE 900
PASADENA, CALIFORNIA 91101
Correspondence name and address
JODY HAWKE
1000 WILSHIRE BOULEVARD, SUITE 1500
LOS ANGELES, CA 90017-2457

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