Patent Assignment Details
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Reel/Frame: | 050478/0373 | |
| Pages: | 4 |
| | Recorded: | 09/24/2019 | | |
Attorney Dkt #: | 15157-000661-US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/22/2022
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Application #:
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16581093
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Filing Dt:
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09/24/2019
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Publication #:
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Pub Dt:
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01/28/2021
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Title:
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WAFER STRUCTURE AND CHIP STRUCTURE HAVING THROUGH-HOLE ELECTRICAL CONNECTION FOR BONDED CHIPS
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Assignee
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NO. 18, GAOXIN 4TH ROAD |
DONGHU DEVELOPMENT ZONE |
WUHAN, HUBEI, CHINA 430205 |
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Correspondence name and address
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HARNESS, DICKEY & PIERCE, P.L.C.
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P.O. BOX 828
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BLOOMFIELD HILLS, MI 48303
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06/22/2024 10:41 AM
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