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Patent Assignment Details
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Reel/Frame:067741/0373   Pages: 7
Recorded: 06/17/2024
Attorney Dkt #:1451676.147US9
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18720708
Filing Dt:
06/17/2024
Publication #:
Pub Dt:
07/24/2025
Title:
RESIN COMPOSITION, AND MOLDED PRODUCT, CURED PRODUCT, FILM, COMPOSITE MATERIAL, CURED COMPOSITE MATERIAL, LAMINATE, METAL FOIL WITH RESIN, AND VARNISH FOR CIRCUIT BOARD MATERIAL OBTAINEDTHEREFROM
Assignors
1
Exec Dt:
04/10/2024
2
Exec Dt:
04/25/2024
Assignee
1
13-1, NIHONBASHI 1-CHOME, CHUO-KU
TOKYO, JAPAN 1030027
Correspondence name and address
JAMES E. ARMSTRONG IV
LOCKE LORD LLP
701 8TH ST NW, SUITE 500
WASHINGTON, DC 20001-4360

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