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Reel/Frame:057694/0374   Pages: 381
Recorded: 08/03/2021
Attorney Dkt #:FSC - SCI
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1473
Page 6 of 15
Pages: 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
1
Patent #:
Issue Dt:
08/03/2010
Application #:
11620002
Filing Dt:
01/04/2007
Publication #:
Pub Dt:
01/24/2008
Title:
STRUCTURE AND METHOD FOR IMPROVING SHIELDED GATE FIELD EFFECT TRANSISTORS
2
Patent #:
Issue Dt:
10/12/2010
Application #:
11625100
Filing Dt:
01/19/2007
Publication #:
Pub Dt:
11/22/2007
Title:
FLIP CHIP MLP WITH FOLDED HEAT SINK
3
Patent #:
Issue Dt:
08/03/2010
Application #:
11626503
Filing Dt:
01/24/2007
Publication #:
Pub Dt:
07/24/2008
Title:
PRE-MOLDED CLIP STRUCTURE
4
Patent #:
Issue Dt:
03/16/2010
Application #:
11669233
Filing Dt:
01/31/2007
Publication #:
Pub Dt:
05/31/2007
Title:
METHOD OF FABRICATING AN ENHANCED RESURF HVPMOS DEVICE
5
Patent #:
Issue Dt:
10/26/2010
Application #:
11671065
Filing Dt:
02/05/2007
Publication #:
Pub Dt:
08/07/2008
Title:
SEMICONDUCTOR DIE PACKAGE INCLUDING LEADFRAME WITH DIE ATTACH PAD WITH FOLDED EDGE
6
Patent #:
Issue Dt:
01/11/2011
Application #:
11672728
Filing Dt:
02/08/2007
Publication #:
Pub Dt:
08/16/2007
Title:
MULTI-CHIP MODULE FOR BATTERY POWER CONTROL
7
Patent #:
Issue Dt:
06/30/2009
Application #:
11673259
Filing Dt:
02/09/2007
Publication #:
Pub Dt:
08/23/2007
Title:
METHOD FOR REDUCING INSERTION LOSS AND PROVIDING POWER DOWN PROTECTION FOR MOSFET SWITCHES
8
Patent #:
Issue Dt:
07/21/2009
Application #:
11673487
Filing Dt:
02/09/2007
Publication #:
Pub Dt:
08/14/2008
Title:
SCALABLE POWER FIELD EFFECT TRANSISTOR WITH IMPROVED HEAVY BODY STRUCTURE AND METHOD OF MANUFACTURE
9
Patent #:
Issue Dt:
07/21/2009
Application #:
11675564
Filing Dt:
02/15/2007
Publication #:
Pub Dt:
08/21/2008
Title:
HIGH DIRECTIVITY ULTRA-COMPACT COUPLER
10
Patent #:
NONE
Issue Dt:
Application #:
11675596
Filing Dt:
02/15/2007
Publication #:
Pub Dt:
08/21/2008
Title:
Integrated Hydrogen Anneal and Gate Oxidation for Improved Gate Oxide Integrity
11
Patent #:
Issue Dt:
10/27/2009
Application #:
11675759
Filing Dt:
02/16/2007
Publication #:
Pub Dt:
06/21/2007
Title:
INTEGRATED CIRCUIT STRUCTURE WITH IMPROVED LDMOS DESIGN
12
Patent #:
NONE
Issue Dt:
Application #:
11682613
Filing Dt:
03/06/2007
Publication #:
Pub Dt:
07/05/2007
Title:
METHOD OF DRIVING A DUAL GATED MOSFET
13
Patent #:
Issue Dt:
06/30/2009
Application #:
11683128
Filing Dt:
03/07/2007
Publication #:
Pub Dt:
09/11/2008
Title:
MULTI-MODE POWER AMPLIFIER WITH LOW GAIN VARIATION OVER TEMPERATURE
14
Patent #:
Issue Dt:
10/13/2009
Application #:
11685364
Filing Dt:
03/13/2007
Publication #:
Pub Dt:
09/18/2008
Title:
SHORT CHANNEL LV, MV, AND HV CMOS DEVICES
15
Patent #:
NONE
Issue Dt:
Application #:
11688816
Filing Dt:
03/20/2007
Publication #:
Pub Dt:
10/11/2007
Title:
FM Power Amplifier With Antenna Power Control
16
Patent #:
Issue Dt:
04/21/2009
Application #:
11688835
Filing Dt:
03/20/2007
Publication #:
Pub Dt:
07/03/2008
Title:
EFFICIENT VOLTAGE RAIL GENERATION
17
Patent #:
Issue Dt:
09/08/2009
Application #:
11689971
Filing Dt:
03/22/2007
Publication #:
Pub Dt:
10/18/2007
Title:
ALTERNATIVE FLIP CHIP IN LEADED MOLDED PACKAGE DESIGN AND METHOD FOR MANUFACTURE
18
Patent #:
Issue Dt:
04/07/2009
Application #:
11690575
Filing Dt:
03/23/2007
Publication #:
Pub Dt:
09/25/2008
Title:
OVER-VOLTAGE TOLERANT PASS-GATE
19
Patent #:
NONE
Issue Dt:
Application #:
11690900
Filing Dt:
03/26/2007
Publication #:
Pub Dt:
09/27/2007
Title:
SEMICONDUCTOR DEVICE WITH SOLDERABLE LOOP CONTACTS
20
Patent #:
Issue Dt:
12/27/2011
Application #:
11690908
Filing Dt:
03/26/2007
Publication #:
Pub Dt:
09/27/2007
Title:
SEMICONDUCTOR DEVICES AND ELECTRICAL PARTS MANUFACTURING USING METAL COATED WIRES
21
Patent #:
Issue Dt:
09/01/2009
Application #:
11693141
Filing Dt:
03/29/2007
Publication #:
Pub Dt:
02/14/2008
Title:
FLIP CHIP IN LEADED MOLDED PACKAGE AND METHOD OF MANUFACTURE THEREOF
22
Patent #:
Issue Dt:
01/27/2009
Application #:
11694704
Filing Dt:
03/30/2007
Publication #:
Pub Dt:
10/02/2008
Title:
METHOD AND STRUCTURE FOR MAKING A TOP-SIDE CONTACT TO A SUBSTRATE
23
Patent #:
NONE
Issue Dt:
Application #:
11695199
Filing Dt:
04/02/2007
Publication #:
Pub Dt:
10/04/2007
Title:
SELF-ALIGNED COMPLEMENTARY LDMOS
24
Patent #:
Issue Dt:
09/13/2011
Application #:
11707685
Filing Dt:
02/16/2007
Title:
OVER-CURRENT PROTECTION FOR A POWER CONVERTER
25
Patent #:
Issue Dt:
02/23/2010
Application #:
11724786
Filing Dt:
03/15/2007
Publication #:
Pub Dt:
09/18/2008
Title:
CONTROL INTERFACE AND PROTOCOL
26
Patent #:
Issue Dt:
08/24/2010
Application #:
11726939
Filing Dt:
03/23/2007
Publication #:
Pub Dt:
09/25/2008
Title:
SOFT START CIRCUIT WITH SLEW RATE CONTROLLER FOR VOLTAGE REGULATORS
27
Patent #:
Issue Dt:
02/09/2010
Application #:
11735257
Filing Dt:
04/13/2007
Publication #:
Pub Dt:
10/16/2008
Title:
OPTICAL COUPLER PACKAGE
28
Patent #:
Issue Dt:
03/23/2010
Application #:
11737630
Filing Dt:
04/19/2007
Publication #:
Pub Dt:
10/23/2008
Title:
ETCHED LEADFRAME STRUCTURE INCLUDING RECESSES
29
Patent #:
Issue Dt:
08/17/2010
Application #:
11740475
Filing Dt:
04/26/2007
Publication #:
Pub Dt:
11/22/2007
Title:
DUAL SIDE COOLING INTEGRATED POWER DEVICE MODULE AND METHODS OF MANUFACTURE
30
Patent #:
Issue Dt:
08/19/2008
Application #:
11747053
Filing Dt:
05/10/2007
Publication #:
Pub Dt:
08/21/2008
Title:
SYSTEM INCLUDING A HIGH DIRECTIVITY ULTRA-COMPACT COUPLER
31
Patent #:
Issue Dt:
06/08/2010
Application #:
11747847
Filing Dt:
05/11/2007
Publication #:
Pub Dt:
06/12/2008
Title:
STRUCTURE AND METHOD FOR FORMING A PLANAR SCHOTTKY CONTACT
32
Patent #:
NONE
Issue Dt:
Application #:
11758886
Filing Dt:
06/06/2007
Publication #:
Pub Dt:
10/23/2008
Title:
LEAD FRAME FREE PACKAGE AND METHOD OF MAKING
33
Patent #:
NONE
Issue Dt:
Application #:
11772623
Filing Dt:
07/02/2007
Publication #:
Pub Dt:
01/17/2008
Title:
LOW TEMPERATURE, LONG TERM ANNEALING OF NICKEL CONTACTS TO LOWER INTERFACIAL RESISTANCE
34
Patent #:
Issue Dt:
08/31/2010
Application #:
11800384
Filing Dt:
05/04/2007
Publication #:
Pub Dt:
06/26/2008
Title:
BIDIRECTIONAL SIGNAL INTERFACE AND RELATED SYSTEM AND METHOD
35
Patent #:
Issue Dt:
06/01/2010
Application #:
11801642
Filing Dt:
05/10/2007
Title:
POWER CONVERTER USING A SINGLE TAPPED TRANSFORMER FOR MULTIPLE RANGES OF INPUT VOLTAGE
36
Patent #:
Issue Dt:
12/20/2011
Application #:
11801819
Filing Dt:
05/10/2007
Publication #:
Pub Dt:
11/15/2007
Title:
HIGH VOLTAGE SEMICONDUCTOR DEVICE WITH LATERAL SERIES CAPACITIVE STRUCTURE
37
Patent #:
Issue Dt:
08/07/2012
Application #:
11818285
Filing Dt:
06/14/2007
Title:
DELIVERING OPTIMAL CHARGE BURSTS IN A VOLTAGE REGULATOR
38
Patent #:
NONE
Issue Dt:
Application #:
11827755
Filing Dt:
07/13/2007
Publication #:
Pub Dt:
01/15/2009
Title:
Solar module system and method using transistors for bypass
39
Patent #:
Issue Dt:
11/02/2010
Application #:
11827756
Filing Dt:
07/13/2007
Publication #:
Pub Dt:
01/15/2009
Title:
DYNAMIC SELECTION OF OSCILLATION SIGNAL FREQUENCY FOR POWER CONVERTER
40
Patent #:
Issue Dt:
09/08/2009
Application #:
11828283
Filing Dt:
07/25/2007
Publication #:
Pub Dt:
02/21/2008
Title:
WIDE BANDGAP DEVICE IN PARALLEL WITH A DEVICE THAT HAS A LOWER AVALANCHE BREAKDOWN VOLTAGE AND A HIGHER FORWARD VOLTAGE DROP THAN THE WIDE BANDGAP DEVICE
41
Patent #:
Issue Dt:
05/19/2009
Application #:
11829262
Filing Dt:
07/27/2007
Publication #:
Pub Dt:
11/15/2007
Title:
METHOD OF MAKING A MOS-GATED TRANSISTOR WITH REDUCED MILLER CAPACITANCE
42
Patent #:
Issue Dt:
02/16/2010
Application #:
11829793
Filing Dt:
07/27/2007
Publication #:
Pub Dt:
01/31/2008
Title:
DUAL SIDE COOLING INTEGRATED POWER DEVICE PACKAGE AND MODULE WITH A CLIP ATTACHED TO A LEADFRAME IN THE PACKAGE AND THE MODULE AND METHODS OF MANUFACTURE
43
Patent #:
Issue Dt:
08/09/2011
Application #:
11830353
Filing Dt:
07/30/2007
Publication #:
Pub Dt:
02/04/2010
Title:
WAVE DIVISION MULTIPLEXING REPLACEMENT OF SERIALIZATION
44
Patent #:
Issue Dt:
01/20/2009
Application #:
11841162
Filing Dt:
08/20/2007
Publication #:
Pub Dt:
02/07/2008
Title:
MULTI-MODE POWER AMPLIFIER WITH HIGH EFFICIENCY UNDER BACKOFF OPERATION
45
Patent #:
Issue Dt:
12/23/2008
Application #:
11841237
Filing Dt:
08/20/2007
Title:
CLOCKLESS SERIALIZATION USING DELAY CIRCUITS
46
Patent #:
Issue Dt:
08/25/2009
Application #:
11844914
Filing Dt:
08/24/2007
Publication #:
Pub Dt:
02/14/2008
Title:
PACKAGING SYSTEM FOR SEMICONDUCTOR DEVICES
47
Patent #:
NONE
Issue Dt:
Application #:
11845560
Filing Dt:
08/27/2007
Publication #:
Pub Dt:
03/05/2009
Title:
THERMALLY ENHANCED THIN SEMICONDUCTOR PACKAGE
48
Patent #:
Issue Dt:
03/08/2011
Application #:
11846063
Filing Dt:
08/28/2007
Publication #:
Pub Dt:
03/05/2009
Title:
SELF LOCKING AND ALIGNING CLIP STRUCTURE FOR SEMICONDUCTOR DIE PACKAGE
49
Patent #:
Issue Dt:
06/15/2010
Application #:
11847001
Filing Dt:
08/29/2007
Publication #:
Pub Dt:
03/05/2009
Title:
SEMICONDUCTOR DIE PACKAGE INCLUDING HEAT SINKS
50
Patent #:
NONE
Issue Dt:
Application #:
11847512
Filing Dt:
08/30/2007
Publication #:
Pub Dt:
03/06/2008
Title:
RELIABLE WAFER-LEVEL CHIP-SCALE PACKAGE SOLDER BUMP STRUCTURE IN A PACKAGED SEMICONDUCTOR DEVICE
51
Patent #:
NONE
Issue Dt:
Application #:
11847670
Filing Dt:
08/30/2007
Publication #:
Pub Dt:
03/05/2009
Title:
SEMICONDUCTOR DIE PACKAGE INCLUDING STAND OFF STRUCTURES
52
Patent #:
Issue Dt:
07/30/2013
Application #:
11848124
Filing Dt:
08/30/2007
Publication #:
Pub Dt:
02/26/2009
Title:
METHOD AND STRUCTURE FOR SHIELDED GATE TRENCH FET
53
Patent #:
Issue Dt:
04/27/2010
Application #:
11852959
Filing Dt:
09/10/2007
Publication #:
Pub Dt:
04/17/2008
Title:
DEVICES, METHODS, AND SYSTEMS WITH MOS-GATED TRENCH-TO-TRENCH LATERAL CURRENT FLOW
54
Patent #:
Issue Dt:
11/15/2011
Application #:
11856635
Filing Dt:
09/17/2007
Publication #:
Pub Dt:
02/21/2008
Title:
SEMICONDUCTOR DIE PACKAGE USING LEADFRAME AND CLIP AND METHOD OF MANUFACTURING
55
Patent #:
Issue Dt:
07/06/2010
Application #:
11857199
Filing Dt:
09/18/2007
Publication #:
Pub Dt:
03/19/2009
Title:
STACKED SYNCHRONOUS BUCK CONVERTER
56
Patent #:
NONE
Issue Dt:
Application #:
11860217
Filing Dt:
09/24/2007
Publication #:
Pub Dt:
03/26/2009
Title:
BONDING PAD STRUCTURE ALLOWING WIRE BONDING OVER AN ACTIVE AREA IN A SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING SAME
57
Patent #:
Issue Dt:
08/03/2010
Application #:
11861967
Filing Dt:
09/26/2007
Publication #:
Pub Dt:
03/26/2009
Title:
STACKED DUAL-DIE PACKAGES, METHODS OF MAKING, AND SYSTEMS INCORPORATING SAID PACKAGES
58
Patent #:
Issue Dt:
07/12/2011
Application #:
11862396
Filing Dt:
09/27/2007
Title:
FIELD EFFECT TRANSISTOR WITH TRENCH FILLED WITH INSULATING MATERIAL AND STRIPS OF SEMI-INSULATING MATERIAL ALONG TRENCH SIDEWALLS
59
Patent #:
Issue Dt:
08/03/2010
Application #:
11865191
Filing Dt:
10/01/2007
Publication #:
Pub Dt:
04/17/2008
Title:
TAPERED VOLTAGE POLYSILICON DIODE ELECTROSTATIC DISCHARGE CIRCUIT FOR POWER MOSFETS AND ICS
60
Patent #:
Issue Dt:
12/15/2009
Application #:
11866072
Filing Dt:
10/02/2007
Publication #:
Pub Dt:
01/31/2008
Title:
LOW VOLTAGE HIGH DENSITY TRENCH-GATED POWER DEVICE WITH UNIFORMLY DOPED CHANNEL AND ITS EDGE TERMINATION
61
Patent #:
Issue Dt:
09/08/2009
Application #:
11869307
Filing Dt:
10/09/2007
Publication #:
Pub Dt:
04/09/2009
Title:
WIRELESS SEMICONDUCTOR PACKAGE FOR EFFICIENT HEAT DISSIPATION
62
Patent #:
Issue Dt:
11/17/2009
Application #:
11869862
Filing Dt:
10/10/2007
Publication #:
Pub Dt:
04/16/2009
Title:
PINCHED POLY FUSE
63
Patent #:
Issue Dt:
09/21/2010
Application #:
11873725
Filing Dt:
10/17/2007
Publication #:
Pub Dt:
04/23/2009
Title:
METHOD FOR CONNECTING A DIE ATTACH PAD TO A LEAD FRAME AND PRODUCT THEREOF
64
Patent #:
Issue Dt:
02/26/2013
Application #:
11891976
Filing Dt:
08/14/2007
Title:
POWER CONVERTER WITH CURRENT VECTOR CONTROLLED DEAD TIME
65
Patent #:
Issue Dt:
06/23/2009
Application #:
11903338
Filing Dt:
09/21/2007
Publication #:
Pub Dt:
01/17/2008
Title:
PARTIAL SWITCH GATE DRIVER
66
Patent #:
Issue Dt:
07/20/2010
Application #:
11909123
Filing Dt:
09/19/2007
Publication #:
Pub Dt:
09/17/2009
Title:
LOW POWER SERDES ARCHITECTURE USING SERIAL I/O BURST GATING
67
Patent #:
Issue Dt:
11/22/2011
Application #:
11927805
Filing Dt:
10/30/2007
Publication #:
Pub Dt:
04/30/2009
Title:
HYBRID-MODE LDMOS
68
Patent #:
NONE
Issue Dt:
Application #:
11930371
Filing Dt:
10/31/2007
Publication #:
Pub Dt:
05/29/2008
Title:
MOS-GATED DEVICE HAVING A BURIED GATE AND PROCESS FOR FORMING SAME
69
Patent #:
NONE
Issue Dt:
Application #:
11930380
Filing Dt:
10/31/2007
Publication #:
Pub Dt:
05/22/2008
Title:
MOS-GATED DEVICE HAVING A BURIED GATE AND PROCESS FOR FORMING SAME
70
Patent #:
NONE
Issue Dt:
Application #:
11930673
Filing Dt:
10/31/2007
Publication #:
Pub Dt:
06/19/2008
Title:
ULTRA DENSE TRENCH-GATED POWER DEVICE WITH REDUCED DRAIN SOURCE FEEDBACK CAPACITANCE AND MILLER CHARGE
71
Patent #:
NONE
Issue Dt:
Application #:
11930686
Filing Dt:
10/31/2007
Publication #:
Pub Dt:
09/04/2008
Title:
ULTRA DENSE TRENCH-GATED POWER DEVICE WITH THE REDUCED DRAIN-SOURCE FEEDBACK CAPACITANCE AND MILLER CHARGE
72
Patent #:
Issue Dt:
05/03/2011
Application #:
11933650
Filing Dt:
11/01/2007
Publication #:
Pub Dt:
05/07/2009
Title:
DIE SCALE STRAIN GAUGE
73
Patent #:
Issue Dt:
11/02/2010
Application #:
11935915
Filing Dt:
11/06/2007
Publication #:
Pub Dt:
05/07/2009
Title:
HIGH BOND LINE THICKNESS FOR SEMICONDUCTOR DEVICES
74
Patent #:
Issue Dt:
05/26/2009
Application #:
11937852
Filing Dt:
11/09/2007
Title:
DIFFERENTIAL AMPLIFIER WITH INDEPENDENT OUTPUT COMMON MODE ADJUSTMENT
75
Patent #:
Issue Dt:
01/06/2009
Application #:
11938583
Filing Dt:
11/12/2007
Publication #:
Pub Dt:
03/13/2008
Title:
METHOD FOR FORMING A SHIELDED GATE TRENCH FET WITH THE SHIELD AND GATE ELECTRODES BEING CONNECTED TOGETHER
76
Patent #:
NONE
Issue Dt:
Application #:
11941322
Filing Dt:
11/16/2007
Publication #:
Pub Dt:
05/21/2009
Title:
Back to Back Die Assembly For Semiconductor Devices
77
Patent #:
NONE
Issue Dt:
Application #:
11944281
Filing Dt:
11/21/2007
Publication #:
Pub Dt:
05/21/2009
Title:
Multi-Terminal Package Assembly For Semiconductor Devices
78
Patent #:
NONE
Issue Dt:
Application #:
11948081
Filing Dt:
11/30/2007
Publication #:
Pub Dt:
06/04/2009
Title:
PACKAGE INCLUDING ORIENTED DEVICES
79
Patent #:
Issue Dt:
09/15/2009
Application #:
11948170
Filing Dt:
11/30/2007
Publication #:
Pub Dt:
06/04/2009
Title:
SEMICONDUCTOR DIE PACKAGES SUITABLE FOR OPTOELECTRONIC APPLICATIONS HAVING CLIP ATTACH STRUCTURES FOR ANGLED MOUNTING OF DICE
80
Patent #:
Issue Dt:
10/06/2009
Application #:
11952481
Filing Dt:
12/07/2007
Publication #:
Pub Dt:
04/17/2008
Title:
METHOD FOR FORMING INTER-POLY DIELECTRIC IN SHIELDED GATE FIELD EFFECT TRANSISTOR
81
Patent #:
Issue Dt:
08/24/2010
Application #:
11959800
Filing Dt:
12/19/2007
Publication #:
Pub Dt:
06/25/2009
Title:
PACKAGE WITH MULTIPLE DIES
82
Patent #:
Issue Dt:
10/26/2010
Application #:
11961589
Filing Dt:
12/20/2007
Publication #:
Pub Dt:
05/08/2008
Title:
THIN, THERMALLY ENHANCED FLIP CHIP IN A LEADED MOLDED PACKAGE
83
Patent #:
Issue Dt:
02/01/2011
Application #:
11962571
Filing Dt:
12/21/2007
Publication #:
Pub Dt:
06/25/2009
Title:
METHODS AND SYSTEMS FOR CONTROL OF SWITCHES IN POWER REGULATORS/POWER AMPLIFIERS
84
Patent #:
Issue Dt:
09/06/2011
Application #:
11963668
Filing Dt:
12/21/2007
Publication #:
Pub Dt:
01/08/2009
Title:
POWER SEMICONDUCTOR DEVICES WITH TRENCHED SHIELDED SPLIT GATE TRANSISTOR AND METHODS OF MANUFACTURE
85
Patent #:
Issue Dt:
08/10/2010
Application #:
11964283
Filing Dt:
12/26/2007
Publication #:
Pub Dt:
07/02/2009
Title:
SHEILDED GATE TRENCH FET WITH MULTIPLE CHANNELS
86
Patent #:
Issue Dt:
09/06/2011
Application #:
11964419
Filing Dt:
12/26/2007
Publication #:
Pub Dt:
01/08/2009
Title:
POWER SEMICONDUCTOR DEVICES WITH SHIELD AND GATE CONTACTS AND METHODS OF MANUFACTURE
87
Patent #:
NONE
Issue Dt:
Application #:
11965620
Filing Dt:
12/27/2007
Publication #:
Pub Dt:
07/02/2009
Title:
LEAD FRAME DIE ATTACH PADDLES WITH SLOPED WALLS AND BACKSIDE GROOVES SUITABLE FOR LEADLESS PACKAGES
88
Patent #:
Issue Dt:
09/21/2010
Application #:
11968602
Filing Dt:
01/02/2008
Publication #:
Pub Dt:
07/02/2009
Title:
HIGH-POWER SEMICONDUCTOR DIE PACKAGES WITH INTEGRATED HEAT-SINK CAPABILITY AND METHODS OF MANUFACTURING THE SAME
89
Patent #:
Issue Dt:
10/04/2011
Application #:
11970087
Filing Dt:
01/07/2008
Publication #:
Pub Dt:
07/09/2009
Title:
SEMICONDUCTOR PACKAGE WITH AN EMBEDDED PRINTED CIRCUIT BOARD AND STACKED DIE
90
Patent #:
Issue Dt:
09/07/2010
Application #:
11971512
Filing Dt:
01/09/2008
Publication #:
Pub Dt:
07/09/2009
Title:
PACKAGE WITH OVERLAPPING DEVICES
91
Patent #:
Issue Dt:
11/02/2010
Application #:
11971524
Filing Dt:
01/09/2008
Publication #:
Pub Dt:
07/09/2009
Title:
SEMICONDUCTOR DIE PACKAGES HAVING OVERLAPPING DICE, SYSTEM USING THE SAME, AND METHODS OF MAKING THE SAME
92
Patent #:
Issue Dt:
01/31/2012
Application #:
11971556
Filing Dt:
01/09/2008
Publication #:
Pub Dt:
07/09/2009
Title:
DIE PACKAGE INCLUDING SUBSTRATE WITH MOLDED DEVICE
93
Patent #:
Issue Dt:
11/30/2010
Application #:
11971596
Filing Dt:
01/09/2008
Publication #:
Pub Dt:
07/09/2009
Title:
INTEGRATED LOW LEAKAGE DIODE
94
Patent #:
Issue Dt:
12/01/2009
Application #:
11972418
Filing Dt:
01/10/2008
Publication #:
Pub Dt:
07/16/2009
Title:
FLEX CLIP CONNECTOR FOR SEMICONDUCTOR DEVICE
95
Patent #:
Issue Dt:
07/13/2010
Application #:
11972997
Filing Dt:
01/11/2008
Publication #:
Pub Dt:
07/16/2009
Title:
DELAY STABILIZATION FOR SKEW TOLERANCE
96
Patent #:
Issue Dt:
09/29/2009
Application #:
11985457
Filing Dt:
11/15/2007
Title:
LOW-INPUT-VOLTAGE CHARGE PUMP
97
Patent #:
Issue Dt:
05/18/2010
Application #:
11986579
Filing Dt:
11/21/2007
Title:
SOFT-START SYSTEM AND METHOD FOR POWER CONVERTER
98
Patent #:
Issue Dt:
11/23/2010
Application #:
12004279
Filing Dt:
12/19/2007
Publication #:
Pub Dt:
06/25/2009
Title:
PROCESS-INVARIANT LOW-QUIESCENT TEMPERATURE DETECTION CIRCUIT
99
Patent #:
Issue Dt:
01/18/2011
Application #:
12012057
Filing Dt:
01/29/2008
Title:
SYNCHRONOUS BUCK POWER CONVERTER WITH FREE-RUNNING OSCILLATOR
100
Patent #:
NONE
Issue Dt:
Application #:
12014015
Filing Dt:
01/14/2008
Publication #:
Pub Dt:
07/16/2009
Title:
Semiconductor Die Packages Having Solder-free Connections, Systems Using the Same, and Methods of Making the Same
Assignor
1
Exec Dt:
07/22/2021
Assignee
1
5005 E. MCDOWELL ROAD, MD A700
PHOENIX, ARIZONA 85008
Correspondence name and address
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD
MD A700
PHOENIX, AZ 85008

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