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08/03/2010
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11620002
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01/04/2007
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01/24/2008
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Title:
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STRUCTURE AND METHOD FOR IMPROVING SHIELDED GATE FIELD EFFECT TRANSISTORS
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10/12/2010
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11625100
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01/19/2007
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11/22/2007
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Title:
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FLIP CHIP MLP WITH FOLDED HEAT SINK
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08/03/2010
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11626503
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01/24/2007
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07/24/2008
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Title:
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PRE-MOLDED CLIP STRUCTURE
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03/16/2010
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11669233
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01/31/2007
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05/31/2007
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Title:
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METHOD OF FABRICATING AN ENHANCED RESURF HVPMOS DEVICE
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10/26/2010
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11671065
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02/05/2007
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Pub Dt:
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08/07/2008
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Title:
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SEMICONDUCTOR DIE PACKAGE INCLUDING LEADFRAME WITH DIE ATTACH PAD WITH FOLDED EDGE
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Patent #:
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01/11/2011
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11672728
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02/08/2007
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08/16/2007
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Title:
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MULTI-CHIP MODULE FOR BATTERY POWER CONTROL
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06/30/2009
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11673259
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02/09/2007
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Publication #:
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Pub Dt:
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08/23/2007
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Title:
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METHOD FOR REDUCING INSERTION LOSS AND PROVIDING POWER DOWN PROTECTION FOR MOSFET SWITCHES
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07/21/2009
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11673487
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02/09/2007
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Publication #:
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Pub Dt:
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08/14/2008
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Title:
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SCALABLE POWER FIELD EFFECT TRANSISTOR WITH IMPROVED HEAVY BODY STRUCTURE AND METHOD OF MANUFACTURE
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07/21/2009
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11675564
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02/15/2007
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08/21/2008
| | | | |
Title:
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HIGH DIRECTIVITY ULTRA-COMPACT COUPLER
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NONE
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11675596
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02/15/2007
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08/21/2008
| | | | |
Title:
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Integrated Hydrogen Anneal and Gate Oxidation for Improved Gate Oxide Integrity
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10/27/2009
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11675759
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02/16/2007
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06/21/2007
| | | | |
Title:
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INTEGRATED CIRCUIT STRUCTURE WITH IMPROVED LDMOS DESIGN
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NONE
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11682613
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03/06/2007
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Publication #:
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07/05/2007
| | | | |
Title:
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METHOD OF DRIVING A DUAL GATED MOSFET
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06/30/2009
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11683128
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03/07/2007
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Publication #:
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09/11/2008
| | | | |
Title:
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MULTI-MODE POWER AMPLIFIER WITH LOW GAIN VARIATION OVER TEMPERATURE
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Patent #:
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10/13/2009
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11685364
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03/13/2007
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Publication #:
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Pub Dt:
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09/18/2008
| | | | |
Title:
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SHORT CHANNEL LV, MV, AND HV CMOS DEVICES
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Patent #:
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NONE
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Issue Dt:
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11688816
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Filing Dt:
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03/20/2007
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Publication #:
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Pub Dt:
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10/11/2007
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Title:
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FM Power Amplifier With Antenna Power Control
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04/21/2009
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11688835
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03/20/2007
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Publication #:
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Pub Dt:
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07/03/2008
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Title:
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EFFICIENT VOLTAGE RAIL GENERATION
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Patent #:
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Issue Dt:
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09/08/2009
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Application #:
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11689971
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Filing Dt:
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03/22/2007
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Publication #:
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Pub Dt:
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10/18/2007
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Title:
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ALTERNATIVE FLIP CHIP IN LEADED MOLDED PACKAGE DESIGN AND METHOD FOR MANUFACTURE
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Patent #:
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04/07/2009
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Application #:
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11690575
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03/23/2007
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Publication #:
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Pub Dt:
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09/25/2008
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Title:
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OVER-VOLTAGE TOLERANT PASS-GATE
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Patent #:
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NONE
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Application #:
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11690900
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Filing Dt:
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03/26/2007
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Publication #:
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Pub Dt:
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09/27/2007
| | | | |
Title:
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SEMICONDUCTOR DEVICE WITH SOLDERABLE LOOP CONTACTS
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Patent #:
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12/27/2011
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11690908
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03/26/2007
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Publication #:
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Pub Dt:
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09/27/2007
| | | | |
Title:
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SEMICONDUCTOR DEVICES AND ELECTRICAL PARTS MANUFACTURING USING METAL COATED WIRES
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Patent #:
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Issue Dt:
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09/01/2009
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11693141
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Filing Dt:
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03/29/2007
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Publication #:
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Pub Dt:
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02/14/2008
| | | | |
Title:
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FLIP CHIP IN LEADED MOLDED PACKAGE AND METHOD OF MANUFACTURE THEREOF
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Patent #:
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Issue Dt:
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01/27/2009
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Application #:
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11694704
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Filing Dt:
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03/30/2007
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Publication #:
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Pub Dt:
|
10/02/2008
| | | | |
Title:
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METHOD AND STRUCTURE FOR MAKING A TOP-SIDE CONTACT TO A SUBSTRATE
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Patent #:
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NONE
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|
Application #:
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11695199
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Filing Dt:
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04/02/2007
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Publication #:
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Pub Dt:
|
10/04/2007
| | | | |
Title:
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SELF-ALIGNED COMPLEMENTARY LDMOS
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Patent #:
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Issue Dt:
|
09/13/2011
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11707685
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Filing Dt:
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02/16/2007
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Title:
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OVER-CURRENT PROTECTION FOR A POWER CONVERTER
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Patent #:
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Issue Dt:
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02/23/2010
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11724786
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Filing Dt:
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03/15/2007
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Publication #:
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Pub Dt:
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09/18/2008
| | | | |
Title:
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CONTROL INTERFACE AND PROTOCOL
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Patent #:
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Issue Dt:
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08/24/2010
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11726939
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Filing Dt:
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03/23/2007
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Publication #:
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Pub Dt:
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09/25/2008
| | | | |
Title:
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SOFT START CIRCUIT WITH SLEW RATE CONTROLLER FOR VOLTAGE REGULATORS
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Patent #:
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Issue Dt:
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02/09/2010
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Application #:
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11735257
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Filing Dt:
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04/13/2007
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Publication #:
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Pub Dt:
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10/16/2008
| | | | |
Title:
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OPTICAL COUPLER PACKAGE
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Patent #:
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Issue Dt:
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03/23/2010
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Application #:
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11737630
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Filing Dt:
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04/19/2007
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Publication #:
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Pub Dt:
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10/23/2008
| | | | |
Title:
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ETCHED LEADFRAME STRUCTURE INCLUDING RECESSES
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Patent #:
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Issue Dt:
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08/17/2010
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Application #:
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11740475
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Filing Dt:
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04/26/2007
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Publication #:
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Pub Dt:
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11/22/2007
| | | | |
Title:
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DUAL SIDE COOLING INTEGRATED POWER DEVICE MODULE AND METHODS OF MANUFACTURE
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Patent #:
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Issue Dt:
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08/19/2008
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Application #:
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11747053
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Filing Dt:
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05/10/2007
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Publication #:
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Pub Dt:
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08/21/2008
| | | | |
Title:
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SYSTEM INCLUDING A HIGH DIRECTIVITY ULTRA-COMPACT COUPLER
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Patent #:
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Issue Dt:
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06/08/2010
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11747847
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Filing Dt:
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05/11/2007
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Publication #:
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Pub Dt:
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06/12/2008
| | | | |
Title:
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STRUCTURE AND METHOD FOR FORMING A PLANAR SCHOTTKY CONTACT
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11758886
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Filing Dt:
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06/06/2007
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Publication #:
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Pub Dt:
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10/23/2008
| | | | |
Title:
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LEAD FRAME FREE PACKAGE AND METHOD OF MAKING
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11772623
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Filing Dt:
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07/02/2007
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Publication #:
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Pub Dt:
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01/17/2008
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Title:
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LOW TEMPERATURE, LONG TERM ANNEALING OF NICKEL CONTACTS TO LOWER INTERFACIAL RESISTANCE
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Patent #:
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Issue Dt:
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08/31/2010
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11800384
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Filing Dt:
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05/04/2007
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Publication #:
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Pub Dt:
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06/26/2008
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Title:
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BIDIRECTIONAL SIGNAL INTERFACE AND RELATED SYSTEM AND METHOD
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Patent #:
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Issue Dt:
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06/01/2010
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11801642
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Filing Dt:
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05/10/2007
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Title:
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POWER CONVERTER USING A SINGLE TAPPED TRANSFORMER FOR MULTIPLE RANGES OF INPUT VOLTAGE
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Patent #:
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Issue Dt:
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12/20/2011
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11801819
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Filing Dt:
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05/10/2007
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Publication #:
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Pub Dt:
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11/15/2007
| | | | |
Title:
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HIGH VOLTAGE SEMICONDUCTOR DEVICE WITH LATERAL SERIES CAPACITIVE STRUCTURE
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Patent #:
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Issue Dt:
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08/07/2012
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11818285
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Filing Dt:
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06/14/2007
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Title:
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DELIVERING OPTIMAL CHARGE BURSTS IN A VOLTAGE REGULATOR
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11827755
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Filing Dt:
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07/13/2007
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Publication #:
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Pub Dt:
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01/15/2009
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Title:
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Solar module system and method using transistors for bypass
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Issue Dt:
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11/02/2010
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11827756
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Filing Dt:
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07/13/2007
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Publication #:
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Pub Dt:
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01/15/2009
| | | | |
Title:
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DYNAMIC SELECTION OF OSCILLATION SIGNAL FREQUENCY FOR POWER CONVERTER
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Patent #:
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Issue Dt:
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09/08/2009
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Application #:
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11828283
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Filing Dt:
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07/25/2007
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Publication #:
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Pub Dt:
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02/21/2008
| | | | |
Title:
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WIDE BANDGAP DEVICE IN PARALLEL WITH A DEVICE THAT HAS A LOWER AVALANCHE BREAKDOWN VOLTAGE AND A HIGHER FORWARD VOLTAGE DROP THAN THE WIDE BANDGAP DEVICE
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Patent #:
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Issue Dt:
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05/19/2009
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11829262
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07/27/2007
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Publication #:
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Pub Dt:
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11/15/2007
| | | | |
Title:
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METHOD OF MAKING A MOS-GATED TRANSISTOR WITH REDUCED MILLER CAPACITANCE
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Patent #:
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Issue Dt:
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02/16/2010
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Application #:
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11829793
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Filing Dt:
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07/27/2007
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Publication #:
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Pub Dt:
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01/31/2008
| | | | |
Title:
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DUAL SIDE COOLING INTEGRATED POWER DEVICE PACKAGE AND MODULE WITH A CLIP ATTACHED TO A LEADFRAME IN THE PACKAGE AND THE MODULE AND METHODS OF MANUFACTURE
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Patent #:
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Issue Dt:
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08/09/2011
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11830353
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Filing Dt:
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07/30/2007
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Publication #:
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Pub Dt:
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02/04/2010
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Title:
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WAVE DIVISION MULTIPLEXING REPLACEMENT OF SERIALIZATION
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Patent #:
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Issue Dt:
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01/20/2009
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Application #:
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11841162
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Filing Dt:
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08/20/2007
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Publication #:
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Pub Dt:
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02/07/2008
| | | | |
Title:
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MULTI-MODE POWER AMPLIFIER WITH HIGH EFFICIENCY UNDER BACKOFF OPERATION
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Patent #:
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Issue Dt:
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12/23/2008
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Application #:
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11841237
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Filing Dt:
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08/20/2007
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Title:
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CLOCKLESS SERIALIZATION USING DELAY CIRCUITS
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Patent #:
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Issue Dt:
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08/25/2009
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Application #:
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11844914
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Filing Dt:
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08/24/2007
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Publication #:
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Pub Dt:
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02/14/2008
| | | | |
Title:
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PACKAGING SYSTEM FOR SEMICONDUCTOR DEVICES
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11845560
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Filing Dt:
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08/27/2007
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Publication #:
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Pub Dt:
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03/05/2009
| | | | |
Title:
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THERMALLY ENHANCED THIN SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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03/08/2011
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11846063
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Filing Dt:
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08/28/2007
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Publication #:
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Pub Dt:
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03/05/2009
| | | | |
Title:
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SELF LOCKING AND ALIGNING CLIP STRUCTURE FOR SEMICONDUCTOR DIE PACKAGE
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Patent #:
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Issue Dt:
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06/15/2010
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Application #:
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11847001
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Filing Dt:
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08/29/2007
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Publication #:
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Pub Dt:
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03/05/2009
| | | | |
Title:
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SEMICONDUCTOR DIE PACKAGE INCLUDING HEAT SINKS
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|
Patent #:
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NONE
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Issue Dt:
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|
Application #:
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11847512
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Filing Dt:
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08/30/2007
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Publication #:
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Pub Dt:
|
03/06/2008
| | | | |
Title:
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RELIABLE WAFER-LEVEL CHIP-SCALE PACKAGE SOLDER BUMP STRUCTURE IN A PACKAGED SEMICONDUCTOR DEVICE
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11847670
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Filing Dt:
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08/30/2007
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Publication #:
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Pub Dt:
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03/05/2009
| | | | |
Title:
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SEMICONDUCTOR DIE PACKAGE INCLUDING STAND OFF STRUCTURES
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Patent #:
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Issue Dt:
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07/30/2013
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11848124
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Filing Dt:
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08/30/2007
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Publication #:
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Pub Dt:
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02/26/2009
| | | | |
Title:
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METHOD AND STRUCTURE FOR SHIELDED GATE TRENCH FET
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Patent #:
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Issue Dt:
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04/27/2010
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Application #:
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11852959
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Filing Dt:
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09/10/2007
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Publication #:
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Pub Dt:
|
04/17/2008
| | | | |
Title:
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DEVICES, METHODS, AND SYSTEMS WITH MOS-GATED TRENCH-TO-TRENCH LATERAL CURRENT FLOW
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Patent #:
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Issue Dt:
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11/15/2011
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Application #:
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11856635
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Filing Dt:
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09/17/2007
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Publication #:
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Pub Dt:
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02/21/2008
| | | | |
Title:
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SEMICONDUCTOR DIE PACKAGE USING LEADFRAME AND CLIP AND METHOD OF MANUFACTURING
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Patent #:
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Issue Dt:
|
07/06/2010
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Application #:
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11857199
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Filing Dt:
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09/18/2007
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Publication #:
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Pub Dt:
|
03/19/2009
| | | | |
Title:
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STACKED SYNCHRONOUS BUCK CONVERTER
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11860217
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Filing Dt:
|
09/24/2007
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Publication #:
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Pub Dt:
|
03/26/2009
| | | | |
Title:
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BONDING PAD STRUCTURE ALLOWING WIRE BONDING OVER AN ACTIVE AREA IN A SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING SAME
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Patent #:
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Issue Dt:
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08/03/2010
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Application #:
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11861967
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Filing Dt:
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09/26/2007
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Publication #:
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Pub Dt:
|
03/26/2009
| | | | |
Title:
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STACKED DUAL-DIE PACKAGES, METHODS OF MAKING, AND SYSTEMS INCORPORATING SAID PACKAGES
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Patent #:
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Issue Dt:
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07/12/2011
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Application #:
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11862396
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Filing Dt:
|
09/27/2007
|
Title:
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FIELD EFFECT TRANSISTOR WITH TRENCH FILLED WITH INSULATING MATERIAL AND STRIPS OF SEMI-INSULATING MATERIAL ALONG TRENCH SIDEWALLS
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Patent #:
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Issue Dt:
|
08/03/2010
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Application #:
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11865191
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Filing Dt:
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10/01/2007
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Publication #:
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Pub Dt:
|
04/17/2008
| | | | |
Title:
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TAPERED VOLTAGE POLYSILICON DIODE ELECTROSTATIC DISCHARGE CIRCUIT FOR POWER MOSFETS AND ICS
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Patent #:
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Issue Dt:
|
12/15/2009
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Application #:
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11866072
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Filing Dt:
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10/02/2007
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Publication #:
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Pub Dt:
|
01/31/2008
| | | | |
Title:
|
LOW VOLTAGE HIGH DENSITY TRENCH-GATED POWER DEVICE WITH UNIFORMLY DOPED CHANNEL AND ITS EDGE TERMINATION
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|
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Patent #:
|
|
Issue Dt:
|
09/08/2009
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Application #:
|
11869307
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Filing Dt:
|
10/09/2007
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Publication #:
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Pub Dt:
|
04/09/2009
| | | | |
Title:
|
WIRELESS SEMICONDUCTOR PACKAGE FOR EFFICIENT HEAT DISSIPATION
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Patent #:
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|
Issue Dt:
|
11/17/2009
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Application #:
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11869862
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Filing Dt:
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10/10/2007
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Publication #:
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Pub Dt:
|
04/16/2009
| | | | |
Title:
|
PINCHED POLY FUSE
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Patent #:
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|
Issue Dt:
|
09/21/2010
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Application #:
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11873725
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Filing Dt:
|
10/17/2007
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Publication #:
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Pub Dt:
|
04/23/2009
| | | | |
Title:
|
METHOD FOR CONNECTING A DIE ATTACH PAD TO A LEAD FRAME AND PRODUCT THEREOF
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Patent #:
|
|
Issue Dt:
|
02/26/2013
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Application #:
|
11891976
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Filing Dt:
|
08/14/2007
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Title:
|
POWER CONVERTER WITH CURRENT VECTOR CONTROLLED DEAD TIME
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Patent #:
|
|
Issue Dt:
|
06/23/2009
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Application #:
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11903338
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Filing Dt:
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09/21/2007
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Publication #:
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Pub Dt:
|
01/17/2008
| | | | |
Title:
|
PARTIAL SWITCH GATE DRIVER
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Patent #:
|
|
Issue Dt:
|
07/20/2010
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Application #:
|
11909123
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Filing Dt:
|
09/19/2007
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Publication #:
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Pub Dt:
|
09/17/2009
| | | | |
Title:
|
LOW POWER SERDES ARCHITECTURE USING SERIAL I/O BURST GATING
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Patent #:
|
|
Issue Dt:
|
11/22/2011
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Application #:
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11927805
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Filing Dt:
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10/30/2007
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Publication #:
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|
Pub Dt:
|
04/30/2009
| | | | |
Title:
|
HYBRID-MODE LDMOS
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|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
11930371
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Filing Dt:
|
10/31/2007
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Publication #:
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|
Pub Dt:
|
05/29/2008
| | | | |
Title:
|
MOS-GATED DEVICE HAVING A BURIED GATE AND PROCESS FOR FORMING SAME
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|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
11930380
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Filing Dt:
|
10/31/2007
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Publication #:
|
|
Pub Dt:
|
05/22/2008
| | | | |
Title:
|
MOS-GATED DEVICE HAVING A BURIED GATE AND PROCESS FOR FORMING SAME
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|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
11930673
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Filing Dt:
|
10/31/2007
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Publication #:
|
|
Pub Dt:
|
06/19/2008
| | | | |
Title:
|
ULTRA DENSE TRENCH-GATED POWER DEVICE WITH REDUCED DRAIN SOURCE FEEDBACK CAPACITANCE AND MILLER CHARGE
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|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
11930686
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Filing Dt:
|
10/31/2007
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Publication #:
|
|
Pub Dt:
|
09/04/2008
| | | | |
Title:
|
ULTRA DENSE TRENCH-GATED POWER DEVICE WITH THE REDUCED DRAIN-SOURCE FEEDBACK CAPACITANCE AND MILLER CHARGE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/03/2011
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Application #:
|
11933650
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Filing Dt:
|
11/01/2007
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Publication #:
|
|
Pub Dt:
|
05/07/2009
| | | | |
Title:
|
DIE SCALE STRAIN GAUGE
|
|
|
Patent #:
|
|
Issue Dt:
|
11/02/2010
|
Application #:
|
11935915
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Filing Dt:
|
11/06/2007
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Publication #:
|
|
Pub Dt:
|
05/07/2009
| | | | |
Title:
|
HIGH BOND LINE THICKNESS FOR SEMICONDUCTOR DEVICES
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|
|
Patent #:
|
|
Issue Dt:
|
05/26/2009
|
Application #:
|
11937852
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Filing Dt:
|
11/09/2007
|
Title:
|
DIFFERENTIAL AMPLIFIER WITH INDEPENDENT OUTPUT COMMON MODE ADJUSTMENT
|
|
|
Patent #:
|
|
Issue Dt:
|
01/06/2009
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Application #:
|
11938583
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Filing Dt:
|
11/12/2007
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Publication #:
|
|
Pub Dt:
|
03/13/2008
| | | | |
Title:
|
METHOD FOR FORMING A SHIELDED GATE TRENCH FET WITH THE SHIELD AND GATE ELECTRODES BEING CONNECTED TOGETHER
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|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
11941322
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Filing Dt:
|
11/16/2007
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Publication #:
|
|
Pub Dt:
|
05/21/2009
| | | | |
Title:
|
Back to Back Die Assembly For Semiconductor Devices
|
|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
11944281
|
Filing Dt:
|
11/21/2007
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Publication #:
|
|
Pub Dt:
|
05/21/2009
| | | | |
Title:
|
Multi-Terminal Package Assembly For Semiconductor Devices
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|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11948081
|
Filing Dt:
|
11/30/2007
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Publication #:
|
|
Pub Dt:
|
06/04/2009
| | | | |
Title:
|
PACKAGE INCLUDING ORIENTED DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
09/15/2009
|
Application #:
|
11948170
|
Filing Dt:
|
11/30/2007
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Publication #:
|
|
Pub Dt:
|
06/04/2009
| | | | |
Title:
|
SEMICONDUCTOR DIE PACKAGES SUITABLE FOR OPTOELECTRONIC APPLICATIONS HAVING CLIP ATTACH STRUCTURES FOR ANGLED MOUNTING OF DICE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/06/2009
|
Application #:
|
11952481
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Filing Dt:
|
12/07/2007
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Publication #:
|
|
Pub Dt:
|
04/17/2008
| | | | |
Title:
|
METHOD FOR FORMING INTER-POLY DIELECTRIC IN SHIELDED GATE FIELD EFFECT TRANSISTOR
|
|
|
Patent #:
|
|
Issue Dt:
|
08/24/2010
|
Application #:
|
11959800
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Filing Dt:
|
12/19/2007
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Publication #:
|
|
Pub Dt:
|
06/25/2009
| | | | |
Title:
|
PACKAGE WITH MULTIPLE DIES
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|
|
Patent #:
|
|
Issue Dt:
|
10/26/2010
|
Application #:
|
11961589
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Filing Dt:
|
12/20/2007
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Publication #:
|
|
Pub Dt:
|
05/08/2008
| | | | |
Title:
|
THIN, THERMALLY ENHANCED FLIP CHIP IN A LEADED MOLDED PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
02/01/2011
|
Application #:
|
11962571
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Filing Dt:
|
12/21/2007
|
Publication #:
|
|
Pub Dt:
|
06/25/2009
| | | | |
Title:
|
METHODS AND SYSTEMS FOR CONTROL OF SWITCHES IN POWER REGULATORS/POWER AMPLIFIERS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/06/2011
|
Application #:
|
11963668
|
Filing Dt:
|
12/21/2007
|
Publication #:
|
|
Pub Dt:
|
01/08/2009
| | | | |
Title:
|
POWER SEMICONDUCTOR DEVICES WITH TRENCHED SHIELDED SPLIT GATE TRANSISTOR AND METHODS OF MANUFACTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/10/2010
|
Application #:
|
11964283
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Filing Dt:
|
12/26/2007
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Publication #:
|
|
Pub Dt:
|
07/02/2009
| | | | |
Title:
|
SHEILDED GATE TRENCH FET WITH MULTIPLE CHANNELS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/06/2011
|
Application #:
|
11964419
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Filing Dt:
|
12/26/2007
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Publication #:
|
|
Pub Dt:
|
01/08/2009
| | | | |
Title:
|
POWER SEMICONDUCTOR DEVICES WITH SHIELD AND GATE CONTACTS AND METHODS OF MANUFACTURE
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11965620
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Filing Dt:
|
12/27/2007
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Publication #:
|
|
Pub Dt:
|
07/02/2009
| | | | |
Title:
|
LEAD FRAME DIE ATTACH PADDLES WITH SLOPED WALLS AND BACKSIDE GROOVES SUITABLE FOR LEADLESS PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
09/21/2010
|
Application #:
|
11968602
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Filing Dt:
|
01/02/2008
|
Publication #:
|
|
Pub Dt:
|
07/02/2009
| | | | |
Title:
|
HIGH-POWER SEMICONDUCTOR DIE PACKAGES WITH INTEGRATED HEAT-SINK CAPABILITY AND METHODS OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
10/04/2011
|
Application #:
|
11970087
|
Filing Dt:
|
01/07/2008
|
Publication #:
|
|
Pub Dt:
|
07/09/2009
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE WITH AN EMBEDDED PRINTED CIRCUIT BOARD AND STACKED DIE
|
|
|
Patent #:
|
|
Issue Dt:
|
09/07/2010
|
Application #:
|
11971512
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Filing Dt:
|
01/09/2008
|
Publication #:
|
|
Pub Dt:
|
07/09/2009
| | | | |
Title:
|
PACKAGE WITH OVERLAPPING DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
11/02/2010
|
Application #:
|
11971524
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Filing Dt:
|
01/09/2008
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Publication #:
|
|
Pub Dt:
|
07/09/2009
| | | | |
Title:
|
SEMICONDUCTOR DIE PACKAGES HAVING OVERLAPPING DICE, SYSTEM USING THE SAME, AND METHODS OF MAKING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
01/31/2012
|
Application #:
|
11971556
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Filing Dt:
|
01/09/2008
|
Publication #:
|
|
Pub Dt:
|
07/09/2009
| | | | |
Title:
|
DIE PACKAGE INCLUDING SUBSTRATE WITH MOLDED DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
11/30/2010
|
Application #:
|
11971596
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Filing Dt:
|
01/09/2008
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Publication #:
|
|
Pub Dt:
|
07/09/2009
| | | | |
Title:
|
INTEGRATED LOW LEAKAGE DIODE
|
|
|
Patent #:
|
|
Issue Dt:
|
12/01/2009
|
Application #:
|
11972418
|
Filing Dt:
|
01/10/2008
|
Publication #:
|
|
Pub Dt:
|
07/16/2009
| | | | |
Title:
|
FLEX CLIP CONNECTOR FOR SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/13/2010
|
Application #:
|
11972997
|
Filing Dt:
|
01/11/2008
|
Publication #:
|
|
Pub Dt:
|
07/16/2009
| | | | |
Title:
|
DELAY STABILIZATION FOR SKEW TOLERANCE
|
|
|
Patent #:
|
|
Issue Dt:
|
09/29/2009
|
Application #:
|
11985457
|
Filing Dt:
|
11/15/2007
|
Title:
|
LOW-INPUT-VOLTAGE CHARGE PUMP
|
|
|
Patent #:
|
|
Issue Dt:
|
05/18/2010
|
Application #:
|
11986579
|
Filing Dt:
|
11/21/2007
|
Title:
|
SOFT-START SYSTEM AND METHOD FOR POWER CONVERTER
|
|
|
Patent #:
|
|
Issue Dt:
|
11/23/2010
|
Application #:
|
12004279
|
Filing Dt:
|
12/19/2007
|
Publication #:
|
|
Pub Dt:
|
06/25/2009
| | | | |
Title:
|
PROCESS-INVARIANT LOW-QUIESCENT TEMPERATURE DETECTION CIRCUIT
|
|
|
Patent #:
|
|
Issue Dt:
|
01/18/2011
|
Application #:
|
12012057
|
Filing Dt:
|
01/29/2008
|
Title:
|
SYNCHRONOUS BUCK POWER CONVERTER WITH FREE-RUNNING OSCILLATOR
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12014015
|
Filing Dt:
|
01/14/2008
|
Publication #:
|
|
Pub Dt:
|
07/16/2009
| | | | |
Title:
|
Semiconductor Die Packages Having Solder-free Connections, Systems Using the Same, and Methods of Making the Same
|
|