Patent Assignment Details
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| Reel/Frame: | 014999/0374 | |
| Pages: | 3 |
| | Recorded: | 02/19/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/23/2006
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Application #:
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10695666
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Filing Dt:
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10/29/2003
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Publication #:
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Pub Dt:
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07/15/2004
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Title:
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Method for manufacturing a semiconductor device having a multilayer interconnection structure
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Assignee
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| 1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU |
| KAWASAKI-SHI, KANAGAWA 211-8588, JAPAN |
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Correspondence name and address
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WESTERMAN, HATTORI, DANIELS ET AL
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NICOLAS E. SECKEL
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1250 CONNECTICUT AVENUE, N.W., SUITE 700
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WASHINGTON, D.C. 20036
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